ACM Research, Inc. Class A Common Stock

ACM Research, Inc. engages in the development, manufacture, and sale of single-wafer wet cleaning equipment. The company is headquartered in Fremont, California and currently employs 2,513 full-time employees. The company went IPO on 2017-11-03. The company has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. The company has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The company also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.