ACM Research, Inc. engages in the development, manufacture, and sale of single-wafer wet cleaning equipment. The company is headquartered in Fremont, California and currently employs 2,023 full-time employees. The company went IPO on 2017-11-03. The firm offers two principal models of wet wafer cleaning equipment based on its Space Alternated Phase Shift (SAPS) technology, Ultra C SAPS II and Ultra C SAPS V. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional (3D) wafers with fine feature sizes. The company has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The firm also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers.